surface mount pin diodes technical data features unique configurations in surface mount packages add flexibility save board space reduce cost switching low distortion switching low capacitance attenuating low current attenuating for less power consumption matched diodes for consistent performance better thermal conductivity for higher power dissipation low failure in time (fit) rate [1] lead-free option available note: 1. for more information see the surface mount pin reliability data sheet. hsmp-386x series description/applications the hsmp-386x series of general purpose pin diodes are designed for two classes of applications. the first is attenuators where current consumption is the most important design consideration. the second application for this series of diodes is in switches where low capacitance is the driving issue for the designer. the hsmp-386x series total capacitance (c t ) and total resistance (r t ) are typical specifi- cations. for applications that require guaranteed performance, the general purpose hsmp-383x series is recommended. a spice model is not available for pin diodes as spice does not provide for a key pin diode characteristic, carrier lifetime. notes: 1. package marking provides orientation, identification, and date code. 2. see ?lectrical specifications?for appropriate package marking. pin connections and package marking, sot-363 lux 1 2 3 6 5 4
2 package lead code identification, sot-23 (top view) package lead code identification, sot-323 (top view) common cathode #4 common anode #3 series #2 single #0 common cathode f common anode e series c single b package lead code identification, sot-363 (top view) unconnected trio l 123 654 electrical specifications t c = 25 c, each diode pin general purpose diodes, typical specifications t a = 25 c package minimum typical typical part number marking lead breakdown series resistance total capacitance hsmp- code code configuration voltage v br (v) r s ( ? )c t (pf) 3860 l0 [1] 0 single 50 3.0/1.5* 0.20 3862 l2 [1] 2 series 3863 l3 [1] 3 common anode 3864 l4 [1] 4 common cathode 386b l0 [2] b single 386c l2 [2] c series 386e l3 [2] e common anode 386f l4 [2] f common cathode 386l ll [2] l unconnected trio test conditions v r = v br i f = 10 ma v r = 50 v measure f = 100 mhz f = 1 mhz i r 10 a i f = 100 ma* notes: 1. package marking code is laser marked. absolute maximum ratings [1] t c = +25 c symbol parameter unit sot-23 sot-323 i f forward current (1 s pulse) amp 1 1 p iv peak inverse voltage v 50 50 t j junction temperature c 150 150 t stg storage temperature c -65 to 150 -65 to 150 jc thermal resistance [2] c/w 500 150 notes: 1. operation in excess of any one of these conditions may result in permanent damage to the device. 2. t c = +25 c, where t c is defined to be the temperature at the package pins where contact is made to the circuit board. esd warning: handling precautions should be taken to avoid static discharge.
3 hsmp-386x typical parameters at t c = 25 c part number total resistance carrier lifetime reverse recovery time total capacitance hsmp- r t ( ? ) (ns) t rr (ns) c t (pf) 386x 22 500 80 0.20 test conditions i f = 1 ma i f = 50 ma v r = 10 v v r = 50 v f = 100 mhz t r = 250 ma i f = 20 ma f = 1 mhz 90% recovery typical performance, t c = 25 c, each diode figure 1. rf capacitance vs. reverse bias. 0.15 0.30 0.25 0.20 0.35 02 6 41012 816 14 18 20 total capacitance (pf) reverse voltage (v) 1 ghz 100 mhz 1 mhz 120 115 110 105 100 95 90 85 11030 i f ?forward bias current (ma) figure 3. 2nd harmonic input intercept point vs. forward bias current for switch diodes. input intercept point (dbm) diode mounted as a series switch in a 50 ? microstrip and tested at 123 mhz forward current (ma) figure 4. reverse recovery time vs. forward current for various reverse voltages. t rr ?reverse recovery time (ns) 10 100 1000 10 20 30 v r = 5 v v r = 10 v v r = 20 v figure 2. typical rf resistance vs. forward bias current. 0.01 100 1000 1 10 resistance (ohms) bias current (ma) 10 100 1 0.1 t a = +85 c t a = +25 c t a = 55 c 100 10 1 0.1 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 i f ?forward current (ma) v f ?forward voltage (ma) figure 5. forward current vs. forward voltage. 125 c 25 c ?0 c equivalent circuit model hsmp-386x chip* 0.12 pf 1.5 ? r j r s c j r j = 12 ? i 0.9 r t = 1.5 + r j c t = c p + c j i = forward bias current in ma * see an1124 for package models
4 typical applications for multiple diode products figure 10. four diode attenuator. see an1048 for details. input rf in/out fixed bias voltage variable bias figure 6. simple spdt switch, using only positive current. figure 7. high isolation spdt switch, dual bias. figure 8. switch using both positive and negative current. figure 9. very high isolation spdt switch, dual bias. rf common rf 1 bias 1 rf 2 bias 2 rf common bias bias rf 2 rf 1 rf common rf 1 rf 2 bias rf common rf 2 rf 1 bias
5 typical applications for multiple diode products (continued) rf in rf out 1 +v 0 2 0 +v on off 4 5 6 1 11 2 2 3 1 1 2 3 4 0 56 b1 b2 b3 2 3 1 11 rf in rf out 2 2 3 456 1 0 0 2 +v v on off figure 12. hsmp-386l unconnected trio used in a positive voltage, high isolation switch. figure 14. hsmp-386l unconnected trio used in a dual voltage, high isolation switch. figure 13. hsmp-386l used in a sp3t switch. bias figure 11. high isolation spst switch (repeat cells as required). ordering information specify part number followed by option. for example: h smp - 386x - xxx bulk or tape and reel option part number; x = lead code surface mount pin option descriptions -blk = bulk, 100 pcs. per antistatic bag -tr1 = tape and reel, 3000 devices per 7" reel -tr2 = tape and reel, 10,000 devices per 13" reel tape and reeling conforms to electronic industries rs-481, taping of surface mounted components for automated placement. for lead-free option, the part number will have the character "g" at the end, eg. -tr2g for a 10k pc lead-free reel.
6 assembly information sot-323 pcb footprint recommended pcb pad layouts for the miniature sot packages are shown in figures 15, 16, 17. these layouts provide ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 0.035 0.07 0.016 figure 15. pcb pad layout, sot-323. (dimensions in inches). 0.026 0.075 0.016 0.035 figure 16. pcb pad layout, sot-363. (dimensions in inches). 0.037 0.95 0.037 0.95 0.079 2.0 0.031 0.8 dimensions in inches mm 0.035 0.9 figure 17. pcb pad layout, sot-23. time (seconds) t max temperature ( c) 0 0 50 100 150 200 250 60 preheat zone cool down zone reflow zone 120 180 240 300 figure 18. surface mount assembly profile. smt assembly reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g., ir or vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. components with a low mass, such as the sot package, will reach solder reflow temperatures faster than those with a greater mass. agilent s diodes have been qualified to the time-temperature profile shown in figure 18. this profile is representative of an ir reflow type of surface mount assembly process. after ramping up from room temperature, the circuit board with components attached to it (held in place with solder paste) passes through one or more preheat zones. the preheat zones increase the temperature of the board and components to prevent thermal shock and begin evaporat- ing solvents from the solder paste. the reflow zone briefly elevates the temperature sufficiently to produce a reflow of the solder. the rates of change of tempera- ture for the ramp-up and cool- down zones are chosen to be low enough to not cause deformation of the board or damage to compo- nents due to thermal shock. the maximum temperature in the reflow zone (t max ) should not exceed 235 c. these parameters are typical for a surface mount assembly process for agilent diodes. as a general guideline, the circuit board and components should be exposed only to the minimum tempera- tures and times necessary to achieve a uniform reflow of solder.
7 package dimensions outline sot-323 (sc-70, 3 lead) package characteristics lead material ............................ copper (sot-323/363); alloy 42 (sot-23) lead finish ............................................................................ tin-lead 85-15% maximum soldering temperature .............................. 260 c for 5 seconds minimum lead strength .......................................................... 2 pounds pull typical package inductance .................................................................. 2 nh typical package capacitance .............................. 0.08 pf (opposite leads) outline 23 (sot-23) outline 363 (sc-70, 6 lead) 3 1 2 side view top view end view dimensions are in millimeters ( inches ) 1.02 (0.040) 0.89 (0.035) 0.60 (0.024) 0.45 (0.018) 1.40 (0.055) 1.20 (0.047) 2.65 (0.104) 2.10 (0.083) 3.06 (0.120) 2.80 (0.110) 2.04 (0.080) 1.78 (0.070) 1.02 (0.041) 0.85 (0.033) 0.152 (0.006) 0.066 (0.003) 0.10 (0.004) 0.013 (0.0005) 0.69 (0.027) 0.45 (0.018) 0.54 (0.021) 0.37 (0.015) x x x package marking code (xx) date code (x) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) ref. 0.650 bsc (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 ref. 10 0.425 (0.017) typ. dimensions are in millimeters ( inches ) package marking code (xx) x x x date code (x) 2.20 (0.087) 2.00 (0.079) 1.35 (0.053) 1.15 (0.045) 1.30 (0.051) ref. 0.650 bsc (0.025) 2.20 (0.087) 1.80 (0.071) 0.10 (0.004) 0.00 (0.00) 0.25 (0.010) 0.15 (0.006) 1.00 (0.039) 0.80 (0.031) 0.20 (0.008) 0.10 (0.004) 0.30 (0.012) 0.10 (0.004) 0.30 ref. 10 0.425 (0.017) typ. dimensions are in millimeters ( inches ) package marking code (xx) x x x date code (x)
8 device orientation user feed direction cover tape carrier tape reel tape dimensions and product orientation for outline sot-23 for outlines sot-23, -323 note: "ab" represents package marking code. "c" represents date code. end vie w 8 mm 4 mm top view abc abc abc abc end vie w 8 mm 4 mm top view note: "ab" represents package marking code. "c" represents date code. abc abc abc abc for outline sot-363 9 max a 0 p p 0 d p 2 e f w d 1 ko 8 max b 0 13.5 max t1 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 3.15 0.10 2.77 0.10 1.22 0.10 4.00 0.10 1.00 + 0.05 0.124 0.004 0.109 0.004 0.048 0.004 0.157 0.004 0.039 0.002 cavity diameter pitch position d p 0 e 1.50 + 0.10 4.00 0.10 1.75 0.10 0.059 + 0.004 0.157 0.004 0.069 0.004 perforation width thickness w t1 8.00 + 0.30 ? 0.10 0.229 0.013 0.315 + 0.012 ? 0.004 0.009 0.0005 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance between centerline
tape dimensions and product orientation for outlines sot-323, -363 p p 0 p 2 f w c d 1 d e a 0 an t 1 (carrier tape thickness) t t (cover tape thickness) an b 0 k 0 description symbol size (mm) size (inches) length width depth pitch bottom hole diameter a 0 b 0 k 0 p d 1 2.40 0.10 2.40 0.10 1.20 0.10 4.00 0.10 1.00 + 0.25 0.094 0.004 0.094 0.004 0.047 0.004 0.157 0.004 0.039 + 0.010 cavity diameter pitch position d p 0 e 1.55 0.05 4.00 0.10 1.75 0.10 0.061 0.002 0.157 0.004 0.069 0.004 perforation width thickness w t 1 8.00 0.30 0.254 0.02 0.315 0.012 0.0100 0.0008 carrier tape cavity to perforation (width direction) cavity to perforation (length direction) f p 2 3.50 0.05 2.00 0.05 0.138 0.002 0.079 0.002 distance for sot-323 (sc70-3 lead) an 8 c max for sot-363 (sc70-6 lead) 10 c max angle width tape thickness c t t 5.4 0.10 0.062 0.001 0.205 0.004 0.0025 0.00004 cover tape www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (65) 6756 2394 india, australia, new zealand: (65) 6755 1939 japan: (+81 3) 3335-8152(domestic/international), or 0120-61-1280(domestic only) korea: (65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (65) 6755 2044 taiwan: (65) 6755 1843 data subject to change. copyright ? 2004 agilent technologies, inc. obsoletes 5988-7917en ma rch 24 , 2004 5989-0485en
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